AF 126-2 .030WT 3M Structural Adhesive Film 36 in x 36 yd (914 mm x 32 m)

The ready-to-fly structural adhesive film 3M™ Scotch-Weld™ AF 126 is characterized by excellent properties and ease of application. These adhesive films are available in a wide range of weights to meet design requirements without imposing an excess on material cost. All versions of AF 126 are equipped with a non-woven, matte mesh. Thanks to its average resistance to breaking forces, AF 126 provides a reliable, long-lasting bond on composites, metals – solid panels and cellular panels with a honeycomb structure, also in sandwich structures. It is compatible with many substrates and primers. The following 3M™ primers are compatible with AF 126 adhesives: Primer 3M™ Scotch-Weld™ Primer EW 5000 Primer 3M™ Scotch-Weld™ Primer EW 5000 AS Primer 3M™ Scotch-Weld™ Primer EW 5000 ET Primer 3M™ Scotch -Weld™ EC 3917 Primer 3M™ Scotch-Weld™ EC 3924 B Primer Our thermoset, easy-to-apply film is designed to meet a wide range of specifications and requirements from aerospace customers. AF 126 is characterized by high resistance to cracking in various environmental conditions and is really easy to handle. After hardening, it creates a bond of enormous strength, resistant to temperatures ranging from -67°F to 180°F (-55°C to 80°C). It is designed to work in many different environments, on many different projects. What is a structural adhesive film? The fewer rivets in the aircraft, the better! Structural adhesive film allows designers greater design freedom and part innovation, and also reduces the overall number of rivets needed to connect the entire structure. This thermoset, modified epoxy film adhesive can be used to bond a wide variety of substrates, including metals, honeycomb panels and composites. Structural adhesive films are available in a variety of weights and thicknesses, reducing the weight of the joint while maintaining structural integrity. The membranes are available in supported versions, which are usually used for monolithic joints and for sandwich-type cellular boards. They are also available in unsupported versions designed for meshing on cellular boards or honeycomb cellular panels. These films cure at temperatures ranging from 180°F (80°C) to 350°F (170°C). Due to the fact that the films are much less dirty and do not require mixing, they increase the process efficiency of the project. They are easier to use than standard paste adhesives.