• Extrudable through both cartridge and dispensing system • High compressive strength from -55°C to 175°C • Meets stand-alone FAR / JAR 25.853 and ABD 0032 • 101 percent solids and free of shrinkage • Cures to a rigid, solvent resistant material in one hour at 125°C or 175°C • Non-halogenated, no intentionally added antimony • 100% solids with no shrinkage It is designed for use on honeycomb sandwich structures as edge close out, corner reinforcement, local reinforcement for mechanical fixation, or complex gap filling.
EC-3460 HT FST 3M Structural Void Filling Compound 750 ml
672,80 zł inc. VAT
It is designed for use on honeycomb sandwich structures as edge close out, corner reinforcement, local reinforcement for mechanical fixation, or complex gap filling.
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NOTE: THE PRODUCT ON REQUEST IS NOT RETURNABLE
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SKU:
7100176150
Categories: ADHESIVES AND CHEMICALS FOR INDUSTRY, Aerospace
Description
